Stamping-type plating processing equipment
This is a device that can contribute to reducing environmental impact.
The currently mainstream method of electroplating involves placing electrodes and products into a plating bath and passing an electric current, which causes metal ions in the plating solution to move towards the cathode and deposit metal. Since both the products and electrodes are immersed in the plating bath, the tank becomes larger, and the amount of plating solution used also increases. In the stamp-type plating method (SED method), it is possible to stamp (press) a solid electrolyte film onto the necessary parts at high speed, which reduces the amount of chemical solution used. This leads to a reduction in the time required for plating treatment and a compacting of the process, significantly reducing the environmental burden.
- 企業：ミカドテクノス
- 価格：10 million yen-50 million yen
